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This edition was approved for publication by the global Audits and Reviews Subcommittee on December 23
" Where an analytical procedure different from that provided is substituted by a supplier or user
一般に，人間の検査者に代わる計測器実装の困難さは，出所および場所に伴う人的要因の変動にある。
SEMI E78-1105 (complete rewrite)
3D01700 - SEMI 3D17 - Specification for Reference Material for Bonded Wafer Stack Void Metrology StdPbc-0624 This edition was approved forThis Specification describes requisite test structures, including design, manufacturing, and certification procedure for a bonded wafer reference sample composed of two wafers. Referenced SEMI Standards (purchase separately) SEMI 3D13 Guide for Measuring Voids in Bonded Wafer Stacks SEMI M20 Practice for Establishing a Wafer Coordinate System Revision History SEMI 3D17 1123 (technical revision) SEMI 3D17 1217 (first published)
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